Exclusive: Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy

Source: Digitimes· DIGITIMES· July 25, 2026

Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end wafer processing, chiplet integration, packaging, testing and manufact…

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