Samsung and SK Hynix hold back on 3D IC; CXMT and Winbond gain

Source: Digitimes· Charlene Chen· July 29, 2026
Samsung and SK Hynix hold back on 3D IC; CXMT and Winbond gain

AI demand is driving a sharp rise in inquiries about 3D IC, but some in South Korea say the new technology is unlikely to become a fresh growth engine for Samsung Electronics and SK Hynix. Because 3D DRAM is closer to customized memory, mass production could …

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